CXMT Launches Fifth-Gen DRAM Platform in Mass Production

Chinese memory chip manufacturer ChangXin Memory Technologies, known as CXMT, announced on September 20, 2026, that its fifth-generation DRAM manufacturing platform has entered mass production. The announcement was made at the World Manufacturing Convention in Hefei. The new platform utilizes quadruple patterning lithography to achieve a feature spacing of 11.95 nanometers in the memory array. Alongside the process technology, CXMT introduced two new 24-gigabit LPDDR5X memory products designed for smartphones and other portable electronics. The company claims the new platform increases gross die output per wafer by at least 50 percent compared to its previous generation. CXMT has significantly expanded its production capacity in recent years, growing from approximately 40,000 wafers per month in 2020 to around 300,000 wafers per month across its 12-inch fabs in Hefei and Beijing. The company has stated its goal is to reach 350,000 to 375,000 wafers per month by the end of 2026. The announcement follows CXMT's completion of an initial public offering on Shanghai's STAR Market in July 2026, which raised approximately 8.6 billion.