Apple, Broadcom seal $30B+ deal to boost US chip production

Apple and Broadcom have signed a multi-year partnership valued at more than $30 billion to expand domestic production of custom wireless chips, marking Apple’s largest single commitment to U.S. manufacturing to date. The agreement, formally announced on July 8, 2026, extends the companies' existing collaboration through 2031.

The deal is expected to result in the production of more than 15 billion U.S.-made semiconductor components, primarily advanced radio frequency chips known as FBAR filters that enable cellular, WiFi, and Bluetooth connectivity in Apple devices. Broadcom will invest $1.5 billion to expand and modernize its manufacturing campus in Fort Collins, Colorado, to facilitate the production. Apple stated the partnership will support hundreds of American jobs across the supply chain.

Apple CEO Tim Cook described the components built in Fort Collins as critical for delivering the performance and connectivity customers expect. In the announcement, he expressed gratitude to President Donald Trump and his administration for supporting the project. A Trump administration official hailed the investment as a major win for America. Broadcom CEO Hock Tan said the company is...