Xiaomi Unveils Xring O3 Processor With TSMC Partnership

Xiaomi on Monday unveiled its latest proprietary smartphone processor, the Xring O3, manufactured by Taiwan Semiconductor Manufacturing Company using advanced 3-nanometer technology. The new chip is set to power the company's upcoming premium foldable smartphone, marking a significant expansion of its in-house silicon portfolio as it seeks to reduce reliance on external suppliers like Qualcomm and MediaTek.

The announcement, made on August 24, 2026, represents Xiaomi's second custom-designed processor following the debut of the Xring O1 in May 2025. According to sources familiar with the company's strategy, Xiaomi has set shipment targets of 200,000 to 300,000 units for the new foldable device. This move positions Xiaomi to directly challenge Huawei, which dominated China's foldable phone market with a 68% share in the second quarter of 2026. Neither Xiaomi nor TSMC provided official comments on the manufacturing partnership or shipment projections.

The Xring O3 features a 10-core all-big-core CPU design, combining six ultralarge cores with four large cores, which Xiaomi claims delivers a 60% improvement in CPU performance over the previous generation. The chip contains 24...