TSMC adds $100 billion to U.S. chip plan, total $265 billion

Taiwan Semiconductor Manufacturing Company (TSMC) announced on Thursday, July 16, 2026, that it will invest an additional $100 billion in the United States, significantly expanding its semiconductor manufacturing footprint in Arizona. The commitment brings the chipmaker's total pledged U.S. investment to $265 billion and will fund the construction of at least four more fabrication plants producing chips at the 2-nanometer node and below, alongside advanced packaging facilities.

CEO C.C. Wei announced the plan during the company's second-quarter earnings conference, stating the investment aims to support strong, multiyear demand from leading U.S. customers. He said the expansion would foster the development of the U.S. semiconductor ecosystem, strengthen supply chains, and support high-tech, high-paying jobs. The new funds come on top of a previous $165 billion commitment for U.S. operations, which itself followed an initial $65 billion plan announced in 2020.

The announcement coincided with TSMC reporting record financial results, driven by soaring demand for artificial intelligence hardware. Net profit for the April-June quarter reached NT$706.6 billion (approximately $22...