Tecno Unveils Modular Smartphone Concept at MWC 2026

Tecno, a Chinese smartphone manufacturer, has unveiled a modular smartphone concept designed to allow users to customize hardware features through attachable modules, addressing the limitations of traditional fixed-design phones. The prototype, powered by the company's Modular Magnetic Interconnection Technology, will be showcased at the Mobile World Congress in Barcelona starting March 1, 2026.

The base device measures 4.9 millimeters thick, making it one of the slimmest smartphones designed for modular expansion. Available in two variants, the Atom Edition features a silver and red finish, while the Moda Edition has a dark gray and gold design. Both include a matte glass back and a rectangular magnetic array for securing modules. Unlike wireless charging systems such as Apple's MagSafe, Tecno's approach incorporates pogo pins for physical power connections, which the company states run cooler and more efficiently.

Users can attach and detach modules as needed, enabling on-demand upgrades without replacing the entire phone. The ecosystem includes approximately 10 modules, such as a 4.5-millimeter-thick power bank that doubles battery capacity, an action camera for content...