SK Hynix Starts Mass Production of 192GB SOCAMM2 for Nvidia

SK Hynix Inc., a leading memory chip manufacturer, announced on Monday that it has begun mass production of its 192GB SOCAMM2 memory modules, a next-generation technology tailored for Nvidia Corp.'s upcoming Vera Rubin AI platform. The move signals advancing preparations for high-performance AI servers, with initial shipments of the Vera Rubin system expected in the second half of 2026.

The SOCAMM2, or Small Outline Compression Attached Memory Module 2, integrates low-power LPDDR5X DRAM chips produced on SK Hynix's sixth-generation 10-nanometer-class 1c process, a technology typically used in mobile devices but adapted for server environments. This design stacks the chips vertically in a compact form factor, enabling easier upgrades and swaps compared to soldered memory. According to the company, the module delivers more than double the bandwidth and over 75 percent greater power efficiency than conventional RDIMM modules based on DDR5, while achieving data transfer speeds of 9.6 gigabits per second, an improvement from the previous generation's 8.5 Gbps.

These enhancements address critical memory bottlenecks in AI workloads, particularly during the training and inference of...