SK Hynix ships 12-layer HBM4E samples to major customers

South Korean semiconductor manufacturer SK Hynix announced on Thursday, June 18, 2026, that it has begun shipping sample units of its next-generation HBM4E high-bandwidth memory to major customers. The 12-layer memory chip features a 48GB capacity, operates at up to 16 gigabits per second per pin, and delivers a power efficiency improvement of over 20 percent compared to its predecessor.

The move accelerates a critical race among the world's leading memory manufacturers to supply the advanced components needed for artificial intelligence systems. High-bandwidth memory modules sit alongside AI accelerators, rapidly feeding them the massive volumes of data required for training and inference tasks. SK Hynix, a primary supplier to chipmaker Nvidia, had initially targeted the second half of 2026 for these samples but pushed the timeline forward by several months due to faster-than-expected development.

The company credits its Advanced MRMUF manufacturing technology, which involves injecting liquid compounds between stacked chip layers, for enabling the 12-layer design. This technique reportedly provides a 17 percent improvement in heat resistance, a crucial factor for maintaining...