SK Hynix Breaks Ground on $4 Billion Indiana AI Memory Facility

South Korean chipmaker SK Hynix broke ground on a more than $4 billion advanced packaging facility for artificial intelligence memory in Indiana on Thursday, marking a major step in its plan to establish a key U.S. production base for high-bandwidth memory (HBM) chips critical to AI computing. The ceremony at Purdue University in West Lafayette launched the company's first U.S. hub for next-generation HBM, with volume production of its latest HBM4E chips targeted for the third quarter of 2029. The 133.5-acre plant is scheduled to open its cleanroom in the second half of 2028.