Samsung to Start HBM4 Production in February 2026

Samsung Electronics is set to begin mass production of its next-generation high-bandwidth memory chips, known as HBM4, in February 2026, paving the way for supplies to Nvidia and potentially Advanced Micro Devices. The South Korean company completed final qualification tests with Nvidia after submitting initial samples in September 2025, according to industry sources familiar with the matter.

The move marks a significant step for Samsung in the competitive AI memory market, where high-bandwidth memory chips play a critical role in enabling AI accelerators to process vast amounts of data efficiently. These specialized components are essential for advanced processors used in artificial intelligence applications. Samsung has been working to close the gap with rivals SK Hynix and Micron Technology, which have established stronger positions as suppliers to major chipmakers. SK Hynix currently serves as Nvidia's primary provider for the most advanced memory chips in top-tier AI systems.

Production will ramp up at Samsung's facilities, with shipments expected to follow shortly after the February start, though exact delivery schedules remain undisclosed. A Samsung representative...