Samsung and Broadcom forge $200B AI chip partnership

Samsung Electronics and U.S. chip designer Broadcom have signed a major strategic partnership valued at over 200 billion dollars, a move set to reshape the competitive landscape for artificial intelligence semiconductors. The companies announced a memorandum of understanding on July 24 at an AI summit in San Francisco, outlining a multi-year collaboration through 2030 that spans high-bandwidth memory supply, advanced foundry manufacturing, and next-generation packaging.

The non-binding agreement represents one of the largest disclosed semiconductor partnerships and is a cornerstone of broader technology cooperation between South Korean and U.S. firms, which was valued at approximately 950 billion dollars during the summit hosted by South Korean President Lee Jae Myung. The partnership aims to combine Broadcom’s expertise in designing custom AI accelerators with Samsung’s manufacturing capabilities. Specifically, Samsung will supply next-generation high-bandwidth memory, including HBM4 and HBM4E chips, and will produce Broadcom’s designs using its sub-2-nanometer process technology at its Pyeongtaek campus in South Korea.

For Broadcom, a leading designer of application-specific...