Odisha, Intel to Explore $3.3 B Semiconductor Substrate Plant

In a significant step toward building a domestic semiconductor industry, the state government of Odisha has signed a memorandum of understanding with Intel Corporation and 3D Glass Solutions (3DGS) to explore establishing an advanced semiconductor substrate manufacturing facility. The proposed project, announced on Friday, involves an estimated investment of $3.3 billion and is planned for the Bhubaneswar-Khurda region.

The facility would focus on producing advanced packaging glass core substrates and high-density interconnect substrates, critical components for next-generation semiconductors. These substrates form the foundational layer on which chips are mounted, managing electrical signals and heat in high-performance applications like artificial intelligence, data centers, and advanced electronics. Officials stated the project is expected to be implemented in phases over five to six years.

The agreement marks a notable engagement for Intel in India’s semiconductor manufacturing landscape, with the company slated to provide technology know-how and process expertise. The project is projected to create over 1,800 direct high-skilled jobs and generate significant indirect...