India's First 3D Glass Semiconductor Unit Launched in Odisha

Odisha Chief Minister Mohan Charan Majhi and Union Minister for Electronics and Information Technology Ashwini Vaishnaw laid the foundation stone on Sunday for India's first advanced 3D glass-based semiconductor packaging unit in Bhubaneswar, marking a key step in the country's efforts to build a self-reliant electronics manufacturing sector.

The facility, located at Info Valley in Khordha district, is being developed by Heterogeneous Integration Packaging Solutions Pvt Ltd, a wholly owned Indian subsidiary of U.S.-based 3D Glass Solutions Inc. Officials described the project as a greenfield, vertically integrated advanced packaging and embedded glass substrate assembly, testing, marking and packaging facility. It introduces cutting-edge 3D heterogeneous integration technology and glass substrate-based chip packaging to India for the first time.

The initiative involves an investment of approximately Rs 1,943 crore, including Rs 799 crore in central fiscal support and Rs 399.5 crore from the state. Once operational, the unit is projected to produce 70,000 glass panels, 50 million assembled units and 13,000 advanced 3D heterogeneous integration modules annually. These components...