Broadcom in talks for $60B+ AI chip debt financing

Broadcom is in advanced negotiations with a group of lenders to secure more than $60 billion in debt financing to support the production of artificial intelligence chips for Anthropic and other major technology companies, according to people familiar with the matter. The financing package, which could ultimately reach as high as $100 billion, underscores the massive capital requirements fueling the global AI infrastructure buildout and the growing role of debt markets in funding it.

The proposed deal structure includes a senior secured debt tranche ranging from approximately $60 billion to $70 billion, a portion of which Broadcom would guarantee. A separate junior debt tranche of about $30 billion is also under discussion. The total financing would be issued through a special-purpose vehicle, keeping the debt off Broadcom's own balance sheet. Private credit giants Blackstone and Apollo Global Management are in talks to participate in the financing, building on a partnership the three firms established in June.

That earlier agreement involved a $35 billion transaction to expand Anthropic's computing capacity by more than one gigawatt using Broadcom's custom chips and networking...