Apple signs $30 B Broadcom chip deal through 2031

Apple has signed a deal valued at more than $30 billion to purchase custom silicon components and advanced wireless connectivity technologies from Broadcom through 2031, marking the largest commitment under its American Manufacturing Program. The agreement, announced on July 8, 2026, deepens a long-standing partnership between the two companies and includes a $1.5 billion investment by Broadcom to expand its manufacturing facility in Fort Collins, Colorado.

The expansion is expected to support the production of over 15 billion U.S.-made chips, including advanced radio frequency components like FBAR filters, which are critical for wireless connectivity in Apple devices. The investment is projected to create hundreds of manufacturing jobs at the Colorado site. Apple CEO Tim Cook stated that the partnership accelerates the company's commitment to American manufacturing and innovation, emphasizing the importance of U.S.-based suppliers for product performance and quality. Broadcom CEO Hock Tan echoed this sentiment, expressing pride in continuing the decades-long collaboration and expanding the company's manufacturing footprint.

This multi-year supply agreement represents a...