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Amkor, Nvidia sign $1.5 billion advanced packaging deal

Published 24 July 2026

Shares of Amkor Technology surged in after-hours trading on Thursday, July 23, 2026, after the semiconductor packaging company announced a multiyear strategic partnership with Nvidia valued at $1.5 billion to expand advanced chip packaging and testing capacity in the United States. The collaboration is aimed at developing next-generation technologies for artificial intelligence and accelerated computing.

The agreement includes a prepayment from Nvidia that will help fund the expansion of Amkor’s advanced semiconductor packaging capacity, particularly at its site in Arizona. The companies plan to jointly develop advanced packaging methods, including high-density interconnects and heterogeneous integration, which combine different types of chips into a single package to improve performance and energy efficiency. The move is a response to growing demand for more powerful and efficient hardware to support expanding AI infrastructure.

Amkor has been a longstanding packaging partner for Nvidia, providing solutions for products like AI data center processors and networking chips. The expanded partnership is designed to accelerate the development and scaling of new packaging...

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